Implementation method for stacked connection between isolated circuit components and the circuit thereof

ABSTRACT

The present invention discloses a modularized circuit for isolated circuit, wherein the isolated circuit includes at least two circuit components connecting in parallel and/or series, the circuit components, according to a circuit connection configuration, weld corresponding pins of the components directly, forming an integrated module in accordance with a desired connection method of the circuit, and saving circuit boards and wires; the circuit components are designed as a parallelepiped, and a plurality of bonding pads are arranged on part of an area on a surface of the parallelepiped. Due to constructing a circuit unit by welding connections in a way of building blocks, welding directly between components in a 3D space, comparing to the circuits limited in a circuit board plane as a PCB, it owns a wider design space.

CROSS-REFERENCES TO RELATED APPLICATIONS

This application is the continuation-in-part application of applicationSer. No. 15/258,788, filed on Sep. 7, 2016, which claims the priority ofChinese patent application no. 201610259246.X, filed on Apr. 25, 2016,the entire contents of all of which are incorporated herein byreference.

FIELD OF THE INVENTION

The present invention relates to a circuit hardware implementationmodule and the circuit thereof, and, more particularly, to a brand newcircuit implementation module and the circuit apparatus thereof.

BACKGROUND

For a circuit arrangement method in the prior art, except for anintegrated circuit (IC) adopting a highly integrated circuit connectionmethod, a plurality of conventional circuits and peripheral circuitsaround an IC chip are still adopting an isolated circuit, that is, acircuit is connected by adopting a plurality of isolated circuitcomponents according to a circuit schematics, so as to achieve afunction of the circuit.

A commonly used isolated circuit components mainly includes: a resistor,a capacitor, a diode, a triode etc., wherein, a conventional circuitcomponent is welded onto a printed circuit board (PCB), by adopting amethod of welding pins; of course, a simple circuit may also beconnected directly by wires, such as some circuits for experimentalunits.

Following a progress of a circuit processing art, specifically, in orderto be convenient for an automatically welding and processing art,currently, the isolated circuit components are no longer adopting themethod of welding pins, instead, a method of designing an electriccomponent as a chip shape is adopted, including the resistor, the diode,the triode and more, specifically, by sharing a chip processing art ofan IC chip, each chip component may be mounted onto the PCB through anautomatic chip welding machine.

However, no matter either the above conventional pins welding art, orthe chip components mounting art, generally, a component is welded ontoa printed circuit board, that is, a PCB, usually, it is pre-designedbefore being pre-processed well in a PCB processing plant, in order topre-print the majority of circuit wires onto a plate of insulationmaterial, and circuits are printed on this insulation material followinga pre-designed circuit configuration.

This kind of conventional circuit design method is subjected to a 2Dprinting art of the circuit board, the whole circuit is limited by sizesof the circuit board, while the circuit shall be distributed and formedon a circuit board plane; also, due to a requirement of using circuitboards, whose space size may not be designed flexibly, thus, a volume ofthe designed circuit board may not adapt to any small size products.

Therefore, the current technology needs to be improved and developed.

BRIEF SUMMARY OF THE DISCLOSURE

According to the above described defects, the purpose of the presentinvention is providing an implementation module for stacked connectionbetween isolated circuit components and the circuit thereof, whosecircuit implementation method may be considered in a 3D space, withoutany PCBs or wires, to achieve a simple but unrestricted free circuit andthe implementation module thereof.

In order to achieve the above mentioned goals, the technical solution ofthe present invention to solve the technical problems is as follows:

A modularized circuit for isolated circuit, wherein the isolated circuitincludes at least two circuit components connecting in parallel and/orseries; the circuit components, in accordance with a circuit connectionconfiguration, weld a plurality of corresponding pins of the componentsdirectly, making the components form an integrated module in accordancewith a desired connection method of the circuit, and saving circuitboards and wires; the circuit component is designed in a parallelepiped,and a plurality of bonding pads are arranged on part of an area on asurface of the parallelepiped.

The modularized circuit, wherein the circuit components include aresister, a capacitor and/or an inductor, and bonding pads are arrangedon at least two end faces of the resister/the capacitor/the inductor.

The modularized circuit, wherein the circuit components include a diode,and two bonding pads are arranged on a surface of the diode being ableto distinguish different electric current directions

The modularized circuit, wherein the circuit components further includea triode, three different bonding pad areas including a base electrodearea, a collector area and an emitter area are designed on the triode.

An implementation module for stacked connection between isolated circuitcomponents, whose setting is according to circuit components connectingin parallel/series in a circuit, wherein, in accordance with a circuitconnection configuration, a plurality of corresponding pins of thecomponents are welded directly, making the components form an integratedmodule in accordance with a desired connection method of the circuit,and saving a plurality of circuit boards and connection wires; thecircuit component is designed in a parallelepiped, and a plurality ofbonding pads are arranged on part of an area on a surface of theparallelepiped.

The implementation module for stacked connection between isolatedcircuit components, wherein the components comprise a resistor, andbonding pads are arranged on at least two end faces of the resistor.

The implementation module for stacked connection between isolatedcircuit components, wherein the resistor has a bonding pad arranged onat least one body side face.

The implementation module for stacked connection between isolatedcircuit components, wherein, the components further include a diode, thediode has two bonding pads arranged for distinguishing different currentdirections, the bonding pads are arranged on the side face and/or endface of the parallelepiped of the diode.

The implementation module for stacked connection between isolatedcircuit components, wherein the components further include a triode, onthe parallelepiped of the triode, at least three different bonding padsfor a base electrode, a collector and an emitter are arranged; thebonding pads for the base electrode and the emitter are arranged oneither end face and one of the side face next to the end facerespectively, while the bonding pad for the collector is arranged on amiddle position around the parallelepiped.

The implementation module for stacked connection between isolatedcircuit components, wherein the parallelepiped has a ratio in length,width and height of 3:2:1 or 3:1:1.

The present invention provides an implementation module for stackedconnection between isolated circuit components and the circuit thereof,due to adopting a plurality of modularized components, and a pluralityof bonding pads arranged on the components convenient for welding, it ispossible to construct a circuit unit by welding in a way of buildingblocks, so as to achieve a circuit easy to design and process, thecircuit needs no presence of a PCB, instead, and forms a circuit unit ofa isolated circuit simply by welding and splicing different componentsonly, so as to form a circuit being able to save the circuit boardspace, and break a plane limit of a 2D circuit board, also, the designand implementation method is not limited to a circuit board welding andprocessing on a 2D plane, it may be achieved in a 3D space throughdirectly welding between components, and comparing to the circuitslimited in a circuit board plane as a PCB in the prior art, it owns awider design space, also, it may shorten the time used for a circuitfrom design to build-up.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a schematic diagram on the circuit of a firstpreferred embodiment of the present invention.

FIG. 2 illustrates a circuit board diagram on the prior art according tothe schematic diagram of the circuit shown in FIG. 1.

FIG. 3 illustrates a circuit module diagram of the present inventionaccording to the schematic diagram of the circuit shown in FIG. 1.

FIG. 4 illustrates a schematic diagram on a modular product of thecircuit provided in the present invention, corresponding to theschematic diagram of the circuit shown in FIG. 3.

FIG. 5a illustrates a schematic diagram on a most basic circuitconnection method in the present invention, that is, a weldingconnection diagram on a series connection.

FIG. 5b illustrates a schematic diagram on a most basic circuitconnection method in the present invention, that is, a weldingconnection diagram on a parallel connection.

FIG. 6 illustrates a schematic diagram on other equal implementations ofthe stacking method shown in FIG. 5 a.

FIG. 7 illustrates a schematic diagram on the circuit of a secondpreferred embodiment of the present invention.

FIG. 8 illustrates a circuit modular diagram of the present inventionaccording to the schematic diagram of the circuit shown in FIG. 7.

FIG. 9 illustrates a schematic diagram on the modular product of thecircuit provided in the present invention corresponding to the schematicdiagram on the circuit shown in FIG. 7.

FIG. 10a, 10b illustrates a three-dimensional schematic diagram on thedifferent parallelepipeds that may be adopted by a triode of the circuitcomponent module in the present invention.

FIG. 10c, 10d illustrates a three-dimensional schematic diagram on thedifferent parallelepipeds that may be adopted by a diode of the circuitcomponent module in the present invention.

FIG. 11a, 11b illustrates respectively a schematic diagram on thebonding pad areas when building a stacked circuit and using a diode ofthe circuit component module in the present invention.

FIG. 12a, 12b, 12c illustrates respectively a schematic diagram on thebonding pad areas when building a stacked circuit and using a triode ofthe circuit component module in the present invention.

DETAILED DESCRIPTION OF EMBODIMENTS

The present invention provides an implementation method for stackedconnection between isolated circuit components and the circuit thereof,in order to make the purpose, technical solution and the advantages ofthe present invention clearer and more explicit, further detaileddescriptions of the present invention are stated here, referencing tothe attached drawings and some preferred embodiments of the presentinvention. It should be understood that the detailed embodiments of theinvention described here are used to explain the present invention only,instead of limiting the present invention.

The implementation method for stacked connection between isolatedcircuit components and the circuit thereof, as provided in the presentinvention, whose setting is point to at least two circuit componentsconnecting in series or parallel in a circuit. Both the method and thecircuit provided in the present invention need no circuit boards,instead, the circuit components are set in a regular shape, andinterconnected in a docking or welding way, to achieve a stacked modularcircuit, and from a view angle of stability of the circuit, connectingin welding is more preferred than that in docking. Due to adopting astacked modular circuit structure, it may execute a free design in a 3Dspace according to a plurality of relatively simple circuits, so as tobreak a thinking way in the prior art for designing a circuit relying ona PCB, and requiring a 2D circuit design. Of course, for a relativelycomplicated circuit configuration, a mathematical topological structureprinciple is required for designing, and a core part of the relativelycomplicated circuit may adopt an IC design, and further design an ICchip in a modular way matching the modular circuit in the presentinvention, so as to facilitate welding and forming an operation circuit.

Each component in the circuit of the present invention may be stackedproperly, following a plurality of connection configuration requirementsof the schematic diagram of the circuit, and adopting a plurality ofconnection methods to generate an electric connection, including weldingor docking a plurality of corresponding pins directly, making componentsform an integrated module and in a stacked way, in accordance with theconnection method required by the circuit diagram, saving circuit boardsand wires, it generates a design approach of a small and flexiblevolume, and forms a 3D circuit module according to a plurality of spacerequirements of the product circuit, therefore achieves a function ofthe circuit.

In the implementation method for stacked connection between eachcomponent as described in the present invention, and the circuitconfiguration thereof, the component includes a plurality of resistorsR10, R20, as shown in FIG. 1, or resistors R1, R2, R3, as shown in FIG.7, each resistor owns a similar configuration, except for the resistancevalue, the resistor is mainly designed as a parallelepiped, such as acuboid, whose specific sizes may be designed according to any realrequirements, or may be configured into different standard sizes inaccordance with any electric features, such as heat dispersionrequirements. For each resistor, at least one bonding pad 110 isarranged on each of both end faces. In such a way, resistors connectedin series may be configured by welding connections extending from end toend.

Preferably, the bonding pad on the resistor may be designed into an Lshape, extending from an end face to a body face, that is, arranging abonding pad on at least one body face electrically connecting to thatarranged on the corresponding end face, and it may be configured that, alength of the bonding pad arranged on the body face exceeds half lengthof the side, as shown in FIG. 3 and FIG. 4.

A specific connection principle is shown in FIGS. 5a and 5b , as shownin FIG. 5a , the welding method for a series connection is weldingoverlapped bonding pads exceeding half length of the side of bothcomponents arranged in parallel, and it equals to a series connection ofboth resistors; as shown in FIG. 5b , when connecting in parallel, bothbonding pads on both sides of the components may be arranged extendingto side faces, so as to welding between bonding pads on both sides whenboth components are arranged in parallel, and forming a connection inparallel.

What are shown in both FIG. 5a and FIG. 5b are two basic unit connectionmethods, while all other circuit configurations in either parallel orseries, may be achieved through combinations of the above two basicconnection methods respectively, while for different connection methods,bonding pads on the components of the present invention, may be arrangedaccording to different configuration feathers, for example, an L-shapedbonding pad structure shown in FIG. 5a is the one suitable forconnection in series, while a square C-shaped bonding pad structureshown in FIG. 5b is the one suitable for connection in parallel. In theconfigurations arrangement of the bonding pads on the components of thepresent invention, it may arrange a plurality of different configurationstandards to distinguish the connection method of the resistor, eitherin series or in parallel, as well as a plurality of configurationmethods of other components, especially a polarity setting of a diodeand more, while standards for these configurations need a furtherdevelopment.

What is shown in FIG. 2 is a circuit board diagram on the implementationmethod of the PCB circuit in the prior art, wherein, each componentneeds to be welded in patches or in jointing onto a reserved position ona pre-printed circuit board, and a formed product of the circuit isobviously different to that in the present invention, while the productin the present invention owns a modular configuration after beingformed, and under a plurality of corresponding designed conditions, itmay form a specific shape for docking, for example, in addition to ashape adapting to a space locating the circuit, it may also formdifferent shapes in a space, including that of a person or an object.

In the implementation method for stacked connection between isolatedcircuit components and the circuit module thereof, the componentsfurther include components with polarized connection directions, such asa diode, as shown in FIG. 3 and FIG. 4, the diode may be designed as thesame shape of the resistor, that is, a parallelepiped, preferably,arranging two bonding pads being able to distinguish different currentdirections for the connection direction of the diode, such as adding alabeled pattern or a plurality of raised dots on a positive electrode,and a more preferably design method is, arranging an unbalanced bondingpad, so as to ensure the polarization usage of the diode.

The implementation method for stacked connection between isolatedcircuit components and the circuit thereof, the components furtherinclude components having more bonding pads, for example, a triode andan IC chip, the triode is also configured as a parallelepiped, and threedifferent bonding pads are arranged onto the parallelepiped, includingeach for a base electrode, a collector and an emitter, for example, anamplifier and superposition circuit shown in FIG. 8 and FIG. 9, whichmay be applied to a sensor switch. The triode is arranged with threebonding pads of E, B, C, wherein, the module for the base electrode,that is, the B module, is arranged in a middle position (for differentbonding configurations, the bonding pads for three electrodes may alsobe arranged in other configurations, for example, setting the B modulefor base electrode onto an end side), and one side face of the wholetriode product is set as an insulating surface, while othercorresponding faces are connected with other components includingresistors or diodes, a modular product after specific connections isshown in FIG. 9, however, a specific topology structure of the productis not limited to the methods of combinations stated above, and theconfiguration for bonding pads of the circuit components is also notlimited to that of each embodiment of the implementations. Shown as FIG.6, it is also possible to adopt other stacked methods to achieve theconnection in series shown as FIG. 5a . Since there is no limit fromeither face or frame of the circuit board, the possibility of realizinga circuit following the stacked method provided in the present inventionis much higher than that of a conventional PCB method, and it owns amore flexible design space.

The modular circuit for an isolated circuit as provided in the presentinvention, wherein, the isolated circuit includes at least two circuitcomponents connecting in series or in parallel; the circuit components,in accordance with the circuit connection configurations, wherein, thecorresponding pins of the components are welded directly, making thecomponents form an integrated module in accordance with a desiredconnection method of the circuit, saving circuit boards and wires.Wherein, the components including resistors, diodes, triodes and more,are all designed into a parallelepiped, while bonding pads are arrangedfor welding purposes. No matter for a relatively simple isolated circuitor a relatively complex one, through the modular welding configurationsdescribed above according to the present invention, it is possible toachieve a circuit module without any circuit boards or wires, so as tofacilitate the realization of a circuit product in a small space, andthe design is free in spaces, thus helps to produce a brand new circuitmodule.

The implementation module for stacked connections between isolatedcircuit components according to the present invention, is a speciallydesigned modularized structure for realizing the circuit structurestated above, which aims mainly at a plurality of common circuitcomponents, including the resistor, the capacitor, the diode, the triodeand more, it adopts an external standardized modular structure, such asa parallelepiped, and may adopt a relatively uniform modularized sizeconvenient for connection, facilitating to build the circuit up in a wayof building blocks. Each of the circuit components, wherein thestructure inside a body still adopts a specialized configuration methodfor each circuit, for example, a resistor is still a resistor itself,both diodes and triodes are still built by corresponding semiconductorsilicon materials respectively, while only the shape adopts theparallelepiped convenient for stacking. A circuit design andmanufacturing method according to the module and circuit provided in thepresent invention, may make a process and production faster, especiallywhen it is applied to an automatic process and production line, since itneeds no processes for wires or circuit boards, and it has a simplerprocess technology, thus a process and circle from design to productionwill be greatly shorten.

According to different numbers of pins of the circuit components, in theprior art, it adopts a pin method for production, while the circuitcomponents according to the present invention adopt a method ofarranging different bonding pad areas for circuit connections on theparallelepiped surfaces, and in order to facilitate forming the circuitin a way of stacking by building blocks, the sizes of parallelepipedsare configured uniformly. For example, the circuit component of aminimum basic unit adopts a size of the length, width and heightaccording to the corresponding unit size, and a plurality of multiplesmay be applied between each other, so as to facilitate the size of thebuilding-blocks matching a dimension of the circuit component. Forexample, the length is twice or triple of the width and the height, thewidth equals or doubles to the height, in such a way, when forming thecircuit through fitting and stacking the bonding pad areas, it may beeasy to form a neat collocation, and the formed circuit may be easier toform a more neat space-matched shape.

The components applied for isolated circuit according to the presentinvention, include not only resisters, capacitors (ceramic capacitors,electrolytic capacitors), diodes, triodes and more, the method also maybe applied to realizing other components including inductors, CMOS tubesand more, it may even be applied to a packaging structure of anintegrated circuit chip before forming a new type of circuit componentswith the structure of bonding pads three-dimensionally. For example, foran existing component having more than three pins, such as an integratedcircuit chip, it is possible to configure the entire component to form along column of the parallelepiped, whose length may be N times of thewidth, such as ten times or twenty times, and each unit size in thedirection of the length, forms a plurality of sections of the bondingpad areas, facilitating to weld three-dimensionally with the bonding padareas of other corresponding components. Without any wires or PCBs, astacked and three-dimensional isolated circuit may still be achieved.

As shown in FIG. 10a, 10b , it is another implementation method of thecircuit component module according to the present invention, such as atriode, when becoming a parallelepiped triode circuit component, mayadopt two types of size configurations, one is a ratio of 3:2:1 inlength, width and height, refer to FIG. 10a , another is a ratio of3:1:1 in length, width and height, refer to FIG. 10b , of course, in areal implementation, a configuration is designed according to any realrequirements, and is not limited to the two types listed above, buthaving more configurations of ratios and sizes. Such a multiplicativeway to design different sizes of length, width and height hasfacilitated a formation of a relatively neat 3D construction for circuitmodules when a real circuit is buildup in the way of building blocks.When the ratio of the length, width and height is adopting 3:2:1, itfacilitates fitting two or three other circuit components connected inseries or in parallel in a direction of either length or width. Whileadopting a cuboid with a ratio of 3:1:1 in length, width and height, itis possible to fit connecting three circuit components with other unitsizes in the direction of length, so as to form the circuit constructionin a way of building blocks.

Due to a triode is a circuit component having three pins, that is, threeelectrodes of pins of E (emitter), B (base), and C (collector), thus, onan outer surface of the parallelepiped, it needs at least three types ofbonding pad areas for circuit connections, a relatively convenientconfiguration method is, arranging an E electrode 310 and a C electrode320 on two sides close to the end, that is, the end face or a side closeto the end face, while on a middle position, a B electrode 330 isarranged. And, for facilitating matching and building the circuit in thebuilding-block way, the bonding pad areas of different sides of a sameelectrode may not be totally used, for example, as the diode or triodeshown in FIGS. 12a, 12b and 12c , when adopting a ratio of 3:2:1, thebonding pad areas on different sides may be selected for connecting acircuit in series or in parallel. In order to avoid any unnecessaryelectric conductions, for the bonding pad areas need no circuitconnections, it may adopt a method of coating an insulation glue or notloading any conductive materials when manufacturing the circuitcomponents.

FIGS. 10c and 10d , illustrate schematic diagrams on the cuboids thatmay be adopted by a diode of the circuit component module in the presentinvention, whose configuration has a similar size ratio and shape as theFIGS. 10a and 10b . To distinguish a diode from a triode, differentcolors may be adopted, or printing some corresponding identificationsymbols and electrode symbols on the surfaces of the circuit components.To achieve an automatic process and assembly, it may also arrange aplurality of corresponding notch structures on the circuit component, inorder to realize an identification between different components, whichneeds a further research and development. A bonding pad area 410 for thecircuit component such as the diode or the triode, as shown in FIG. 11aor 11 b, in a ratio of 3:1:1, according to requirements of connecting inseries and in parallel, it may select a bonding pad area on the sideface and/or the end face to achieve a corresponding circuit connection.During welding, a weld paste may be coated on the corresponding bondingpad areas, before heating and welding through a certain methods: forexample, through an infrared welding or a high-frequency inductionwelding, or else, to form a solid welding; since the welding is finishedby touching the corresponding bonding pad areas, an area for welding isrelatively large, thus to the circuit, the welding is easier to achieve,without forming any fake welds. To those bonding pad areas needing noconnections, if they are not touchable, they need no processes, or, theymay be coated and isolated by an insulating paste, followed by a certainheating process, such as infrared, to form an insulating paste layerafter curing, and only the bonding pad areas needed by the circuitconnection are left. Through an electric connection between bonding padsof different components in a space, a circuit implementation structurewithout any wires or circuit board carriers is achieved.

In a further improvement, a concept of the circuit componentmodularization of the present invention may also be applied to moreother integrated circuit chips and other components. These circuitcomponents or assembly units with more than three pins, wherein the pinsmay be formed on a plurality of bonding pad areas on the outer surfaceof the parallelpiped of the chip component, so as to facilitate forminga three-dimensional circuit. An idea of the modular design for thecircuit components as disclosed by the present invention may further beapplied to a layout design for an integrated circuit, since it isadopting a design idea of a three-dimensional circuit, an idea of acircuit in space may be achieved through a computer and a space topologyprinciple. Compared to a previous design idea of multi-layer planeIntegrated Circuit layouts, the idea disclosed in the present inventionhas a higher freedom in a design space.

Compared with an SMT (Surface Mount Technology) in the prior art, thethree-dimensional circuit of the present invention formed by the circuitcomponents, may adopt a BMT (Block Mount Technology) or a DMP (DirectMount Technology) technology, that is, in the future technologydevelopment, it needs to develop a design of the three-dimensionalcircuit units assembly and layout, saving the wires and the circuitboards, and welding and manufacturing the circuit directly.

It should be understood that, the application of the present inventionis not limited to the above examples listed. Ordinary technicalpersonnel in this field can improve or change the applications accordingto the above descriptions, all of these improvements and transformsshould belong to the scope of protection in the appended claims of thepresent invention.

What is claimed is:
 1. A modularized circuit for isolated circuit,wherein the isolated circuit includes at least two circuit componentsconnecting in parallel and/or series; the circuit components, inaccordance with a connection configuration of a circuit, weld aplurality of corresponding pins of the circuit components directly,making the circuit components form an integrated module in accordancewith a desired connection method of the circuit, and saving circuitboards and wires; the circuit components are designed in aparallelepiped, and a plurality of bonding pads are arranged on part ofan area on a surface of the parallelepiped.
 2. The modularized circuitaccording to claim 1, wherein, the circuit components include aresistor, a capacitor and/or an inductor, and bonding pads are arrangedon at least two end faces of the resister/the capacitor/the inductor. 3.The modularized circuit according to claim 1, wherein the circuitcomponents include a diode, and two bonding pads are arranged on asurface of the diode being able to distinguish different electriccurrent directions.
 4. The modularized circuit according to claim 1,wherein the circuit components further comprise a triode, threedifferent bonding pad areas including a base electrode area, a collectorarea and an emitter area are designed on the triode.
 5. Animplementation module for stacked connection between isolated circuitcomponents, whose setting is according to circuit components connectingin parallel/series in a circuit, wherein, in accordance with aconnection configuration of the circuit, a plurality of correspondingpins of the circuit components are welded directly, making the circuitcomponents form an integrated module in accordance with a desiredconnection method of the circuit, and saving a plurality of circuitboards and connection wires; the circuit component is designed in aparallelepiped, and a plurality of bonding pads are arranged on part ofan area on a surface of the parallelepiped.
 6. The implementation modulefor stacked connection between isolated circuit components according toclaim 5, wherein the circuit components include a resistor, and bondingpads are arranged on at least two end faces of the resistor.
 7. Theimplementation module for stacked connection between isolated circuitcomponents according to claim 6, wherein the resistor has a bonding padarranged on at least one body side face.
 8. The implementation modulefor stacked connection between isolated circuit components according toclaim 5, wherein, the circuit components further include a diode, thediode has two bonding pads arranged for distinguishing different currentdirections, the bonding pads are arranged on the side face and/or endface of the parallelepiped of the diode.
 9. The implementation modulefor stacked connection between isolated circuit components according toclaim 5, wherein the circuit components further include a triode, on theparallelepiped of the triode, at least three different bonding pads fora base electrode, a collector and an emitter are arranged; the bondingpads for the base electrode and the emitter are arranged on either endface and one of the side face next to the end face accordinglyrespectively, while the bonding pad for the collector is arranged on amiddle position around the parallelepiped.
 10. The implementation modulefor stacked connection between isolated circuit components according toclaim 5, wherein the parallelepiped has a ratio in length, width andheight of 3:2:1 or 3:1:1.